Top Tech Jobs & Startup Jobs in Boston, MA

Leads the design and development of high-speed analog, RF, and mixed-signal ICs for optical communication systems. Responsibilities include architecture, transistor-level design, layout, silicon bring-up, characterization, specification development, design reviews, and collaboration with product engineering and optical systems teams. The role also provides technical leadership and mentorship while applying SiGe BiCMOS and CMOS technologies to TIA, MZMD, and other high-frequency optical front-end components.

Develops high-speed analog ICs exceeding 100 Gbaud for optical networking products. Responsibilities span product definition, circuit design, layout, verification, bring-up, design validation, qualification, testing, characterization, and production ramp-up. The role collaborates with verification, CAD, product, test, operations, and reliability teams and supports system-level customers. Required expertise includes SiGe BiCMOS or CMOS analog design, high-frequency structures, device physics, RF wafer probing, laboratory equipment, and high-speed IC evaluation.

Design and deploy automation systems for high-volume optical transceiver manufacturing, including AI-based machine vision, robotics, motion control, testing, packaging, and process integration. Lead automation from concept through qualification and production ramp, resolve equipment issues, improve yield and throughput, collaborate with vendors and engineering teams, and develop documentation, validation protocols, and capital equipment justifications.

Develop and optimize low-level embedded software and firmware for wireless communication systems. Integrate WiFi and 5G/LTE modules, support board bring-up, and validate hardware-software interactions. Optimize CPU, DSP, FPGA, and power performance; implement secure boot and OTA firmware updates; debug complex subsystem interactions; and collaborate with hardware and cross-functional teams. Maintain technical documentation and participate in code reviews.

Leads global ASIC physical design engineering teams and directs end-to-end physical implementation from RTL to GDSII. Owns methodology development, PPA optimization, low-power design, advanced-node tape-outs, physical verification, risk management, budgets, and schedules. Collaborates with architecture, RTL, DFT, CAD, package, and test teams to achieve first-pass silicon success. Manages EDA vendors and IP providers while mentoring distributed teams across the USA, India, and Italy.

Develops automated hardware and software test solutions for photonic integrated circuits and subassemblies. Responsibilities include designing validation plans, characterizing semiconductor optoelectronic devices, controlling instruments and data acquisition, qualifying production test stations, applying Gage R&R and SPC, documenting solutions, and tracking project milestones. The role requires collaboration across engineering teams and troubleshooting of complex test systems.

Drive design for manufacturability and product quality during new product development. Define DFM targets, conduct process capability studies, develop control plans, lead root-cause and corrective-action activities, and support APQP, product launches, production ramp-up, and continuous improvement. Analyze quality and production data, ensure quality-system compliance, create assembly and packaging documentation, evaluate design value, and collaborate with engineering and manufacturing teams. The role requires expertise in mechanical and electronics manufacturing processes, GD&T, and automotive-quality methodologies, with up to 20% travel.

Develop and implement test plans for coherent optical pluggable products using photonics integrated circuits. Analyze transceiver performance, define testability requirements, validate test platforms, support fault isolation, and coordinate manufacturing integration. Use data analytics and statistical modeling to improve test yield and reduce cycle times while collaborating with development, technical, and manufacturing teams.

Leads the architecture, integration, qualification, and production scaling of automation systems for precision electro-optical manufacturing. Responsibilities include machine vision, AI-based inspection, robotics, motion control, automated testing and packaging, root-cause analysis, equipment selection, documentation, capacity planning, and continuous improvement. The role serves as a senior technical authority, mentors automation engineers, leads design reviews, and collaborates with product, process, test, manufacturing, and external supplier teams.

Drive engineering optimization, yield improvements, automation, and product performance for Nokia’s 800G coherent optical pluggable modules. Analyze large datasets, improve manufacturing capability, maintain product engineering infrastructure, ensure specification traceability, and support prototype development and volume production in collaboration with hardware, test, firmware, reliability, and manufacturing teams.