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Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.
Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!
If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.
Lightmatter is (re)inventing the future of computing with light!
In this role, you will work on leading-edge packaging technologies to enable AI architectures that will set new industry standards regarding compute power, performance, and efficiency. You will collaborate with the packaging team to carry out the required structural analysis for packaging technologies under consideration, identify key failure modes under product use conditions, and run appropriate parametric studies to influence product and package design upstream. You will focus on thermo-mechanical analysis and characterization of advanced photonics packaging technologies, including SI-package 3D stack development and novel fiber attach methods, to define design, material, and process solutions that successfully meet assembly and reliability requirements. The results of your work will lead to advanced package designs that meet power dissipation, assembly, and reliability requirements while delivering a system-level solution for leading-edge products in the AI market.
Responsibilities:
- Develop finite element analysis models for wafer-level and unit-level assembly processes, identifying design, process, and material parameters to mitigate failure modes and optimize yield.
- Develop finite element stress models for photonic packaging.
- Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and material solutions to improve product mechanical integrity.
- Conduct multi-physics simulations, such as solder collapse modeling to define bump architecture or thermal-structural analysis for packaging stress.
- Summarize and communicate findings to key stakeholders across Lightmatter, suppliers, and customers as required.
- Develop automation scripts using Python and MATLAB to improve modeling efficiency.
- Develop analytical or semi-empirical models for quick turn assessments for new product concepts.
- Drive characterization and validation of mechanical designs and electronic assemblies through lab-scale prototyping and/or by initiating appropriate experiments with vendors.
- Write reports and document methodologies.
Required Qualifications:
- MS or PhD in Mechanical Engineering, Material Science, or a related engineering field.
- 8 years of experience in finite element analysis techniques and relevant coursework.
- Proficiency in the use of analysis tools such as ANSYS/ABAQUS and structural design tools like Solidworks and AutoCAD.
- Knowledge of 2D/3D packaging technologies and exposure to the thermo-mechanical challenges associated with these technologies.
- Direct experience applying finite element methods to microelectronics packaging and system-level compute hardware.
Preferred Qualifications:
- Excellent communication skills and the ability to work well in cross-functional teams.
- Ability to work independently and manage multiple projects with minimal supervision.
- Strong creative thinking skills with the ability to solve problems quickly.
We offer competitive compensation. The base salary range for this role determined based on location, experience, educational background, and market data.
- Comprehensive Health Care Plan (Medical, Dental & Vision)
- Retirement Savings Matching Program
- Life Insurance (Basic, Voluntary & AD&D)
- Generous Time Off (Vacation, Sick & Public Holidays)
- Paid Family Leave
- Short Term & Long Term Disability
- Training & Development
- Commuter Benefits
- Flexible, hybrid workplace model
- Equity grants (applicable to full-time employees)
Benefits eligibility may vary depending on your employment status. Lightmatter recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.
Export Control
Candidates should have capacity to comply with the federally mandated requirements of U.S. export control laws.
Lightmatter Boston, Massachusetts, USA Office
At Lightmatter, we have a flexible work structure; employees work remotely and work from our physical offices located in Boston, MA, and Mountain View, CA
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