Design and document mechanical assemblies for thermal interface materials in semiconductor packages. Build, instrument, and test prototypes and mockups, analyze thermal and mechanical data, coordinate fabrication, document customer requirements, and support qualification activities and technical engagements. The role also contributes to product improvements and maintains organized design and test records.
Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases. Its breakthrough Liquid Metal ZRT thermal interface material is designed to solve thermal chokepoints that are facing the next generation of AI and HPC silicon. For more information, visit https://www.bomaterials.com/
THE OPPORTUNITY
A career-defining opportunity rarely offers all of the following:
Direct connection to the mission. Gain a clear understanding of the business and see how your work directly shapes outcomes. With no unnecessary layers, silos, or bureaucracy, every team member contributes meaningfully to the company's success and has the responsibility to drive real impact.
Growth beyond a single role. At Boston Materials, you are not defined by your past experience or limited by a job description. Working alongside leading experts in the field, you will take on new challenges, broaden your expertise, develop new capabilities, and take ownership of projects that matter – while contributing to the broader success of the organization.
Work on problems that matter. Help solve some of the most pressing challenges in the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries. Boston Materials offers a rare combination of purpose, autonomy, and impact. We invite you to join us.
The Role
We are seeking a motivated Mechanical Design Engineer to support the design, prototyping, and testing of our high-performance thermal interface material (TIM) products as customers evaluate and adopt them. This is an early-career role for a hands-on engineer who wants to build depth in mechanical design, semiconductor packaging, and thermal testing. Working under the guidance of senior engineers, you will create CAD models and drawings, build and test assembly mockups, and generate the data that supports customer qualification of our TIM in advanced semiconductor packages. You will be exposed to hyperscaler, ODM, and OSAT programs from day one, with a clear path toward owning customer-facing technical work as you grow.
Join us to solve one of the most critical challenges facing the semiconductor and electronics industry – thermal management!
Your Responsibilities
- Create CAD models, assembly drawings, and fabrication documentation for integrating our liquid-metal based thermal interface materials into customer-specific electronic packages.
- Build, instrument, and test package and assembly mockups to demonstrate design feasibility, including mechanical and reliability testing.
- Run thermal and mechanical test setups, reduce and analyze the resulting data, and summarize findings in clear internal reports.
- Coordinate part fabrication with internal shop resources and external vendors to keep project schedules on track.
- Support senior engineers in customer technical engagements – preparing sample builds, test data packages, and supporting material for application notes and design guides.
- Help capture and document customer technical requirements, including geometric, load, assembly, and environmental constraints, thermal budgets, and reliability standards.
- Support the R&D team in continuous improvement of system and product performance.
- Maintain organized design files, test records, and documentation to support customer qualification processes.
Your Skills and Expertise
- Bachelor's or Master's degree in Mechanical Engineering or a closely related field.
- 0–3 years of professional experience; relevant internship, co-op, or hands-on project experience will be considered.
- Proficiency with CAD modeling and drafting (SolidWorks, Creo, or similar) and a working knowledge of GD&T.
- Hands-on prototyping and lab skills, with comfort building fixtures, running tests, and troubleshooting setups.
- Solid grounding in heat transfer and mechanics fundamentals; interest in electronics packaging and thermal design.
- Strong data analysis and technical writing skills (Excel, Python, or MATLAB a plus).
- Excellent communication skills and the willingness to ask questions, take direction, and learn quickly in a fast-moving environment.
- Exposure to semiconductor packaging, electronics assembly, thermal interface materials, or reliability testing (TCT, HTS, uHAST) is a plus.
- Familiarity with FEA modeling is a plus.
- Up to 10% travel to customer or vendor sites is expected.
Summary of Benefits
- Health, Vision & Dental – Boston Materials pays 75% of Health, Vision and Dental Care coverage for employee and dependents
- 4 weeks of supplemental Paid Parental and Family Leave
- Unlimited Paid Time Off
- Holidays: 14 days/year
Boston Materials is an EOE and at the forefront of materials innovation, the key to which is diverse teams with unique backgrounds and experiences. We are committed to employing a diverse workforce with equal employment opportunities regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, gender expression, marital status, veteran status, or disability.
Applicants must be currently authorized to work in the US on a full-time basis.
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